REMOVAL OF SACRIFICAL MATERIAL TO LEAVE MECHANICAL STRUCTURE

Isotropic etching removes sacrificial materials, and "releases" the 3D MEMS structure. The structure now has Free Surfaces which are pristine and residue free. No pre-treatment, rinse or dry required, fast process times and wide process windows.

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memsstar® SVR™ process modules are used to remove all the sacrificial material quickly without leaving deposits or residues, and with undamaged surfaces