Technology

IN THIS SECTION

 

REMOVAL OF SACRIFICAL MATERIAL TO LEAVE MECHANICAL STRUCTURE

Isotropic etching removes sacrificial materials, and "releases" the 3D MEMS structure. The structure now has Free Surfaces which are pristine and residue free. No pre-treatment, rinse or dry required, fast process times and wide process windows.

this structure has still to be etched  > Release Etch > This structure is completely free standing and residue free

memsstar® SVR process modules are used to remove all the sacrificial material quickly without leaving deposits or residues, and with undamaged surfaces

Marketing Brochure

An overview of release etching

FEATURED CONTENT

Integration

A common technique used in semiconductor fabrication is the use of cluster tools ...

Surface Treatment

Surface Treatment encompasses some distinct surface engineering steps ...

MEMS & Nanotechnology

Every day more applications adopt the use of MEMS micro devices and nanotechnology materials ...