Technology

IN THIS SECTION

 

REMOVE ALL SACRIFICAL MATERIAL USING DRY PROCESSING

Dry isotropic chemical etch removes sacrificial materials, and "releases" the 3D MEMS structure. The structure now has Free Surfaces which are residue free. No pre-treatment, rinse or dry required, fast process times on a wafer or sample scale.

this structure has still to be etched  > Release Etch > This structure is completely free standing and residue free

memsstar® SVR process modules are used to remove all the sacrificial material quickly and without leaving and deposits or residues. This is achieved with 2 etch chemistries;

VHF      Vapour Hydrogen Flouride

XeF2    Xenon Diflouride

 

Marketing Brochure

An overview of release etching

FEATURED CONTENT

MEMS & Nanotechnology

Every day more applications adopt the use of MEMS micro devices and nanotechnology materials ...

Platforms

Any of the Memsstar modules are available in 3 configurations... ...

Sacrificial Vapour Release

memsstar SVR is unique technology using gas phase etching and advanced process controls ...