Technology

IN THIS SECTION

 

CONTROLLED CONTINUOUS FLOW TECHNOLOGY

The unique patented CCFT™ - Controlled Continuous Flow Technology - is used for chemical etch and chemical deposition processes. memsstar® processes reduce issues such as MEMS stiction, compared to other vapour phase or liquid based systems.

Benefits of CCFT™ include the following;

  • Faster process times, highly efficient gas usage, lower COO
  • Faster etch rates, unrivalled selectivities
  • Multi stage processing, e.g. breakthrough, bulk, soft etch steps 
  • Process windows for many materials and layouts
  • Unrivalled wafer uniformity and repeatability
  • Robust Films with superior tunable properties
  • Integrated release etch and then surface modification

 

Marketing Brochure

Process control - an essential requirement for MEMS etching and deposition

FEATURED CONTENT

memsstar® Technical Paper Semicon

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Surface Treatment

Surface Treatment encompasses some distinct surface engineering steps ...

Sacrificial Vapour Release

memsstar® SVR is unique technology using gas phase etching and advanced process controls ...