Point 35 Microstructures in conjunction with the Fraunhofer Institut, today announce a new memsstar® process module solution for advanced MEMS processing. The module uses amorphous silicon, which is more commonly known as a-Si, as a sacrificial layer in the construction of MEMS.
“We have developed a full equipment and process solution for MEMS developers and manufacturers based upon excellent PECVD and SVR etch performance supplied by the memsstar® brand, which we can now jointly take into the market,” said Professor Holger Vogt from Fraunhofer IMS. “We have developed thin and thick film technology which can be doped or undoped and will enable MEMS devices to be created using standard materials within existing wafer fabs and on standard equipment.”
“We are already seeing fast growing sales and a pipeline of development projects, as a direct result of our joint development with Fraunhofer IMS” said Mike Leavy, CEO and co-founder of Point 35 Microstructures. “The ability to implement qualified sacrificial etch schemes using efficient proven equipment, enables MEMS organisations to reduce development time and get their new devices to market faster. The world class processing capability of memsstar® in conjunction with Fraunhofer IMS is very powerful for customers who are developing new MEMS products.”
The new module enables the a-Si film to be deposited in a modified industry standard PECVD reactor as a sacrificial etch layer, for subsequent isotropic release etching using the memsstar® SVR system. The module has fully characterized etch selectivity to many other materials, fast etch rates and excellent uniformity and repeatability. This integrated process sequence can be used within standard CMOS facilities and on top of CMOS wafers if required which will enable many possible new applications.
The memsstar® system uses vapour phase single wafer processing for the release etch and surface modification process steps as required in most MEMS devices. With unique CCFT™ process control technology and an extensive range of chemistries, users get a wide process window and integrated process controls which far exceed other currently available systems and methods. memsstar® systems deliver fast throughput, small footprint, low consumption and emissions, scalable platforms, process controls and high repeatability at a low entry level cost. System configurations can be matched to suit any situation from R&D to high throughput production – with seamless transfer between environments. Applications include motion sensors, micro displays, silicon microphones, fluidic channels, bolometer arrays, pressure sensors and many others.