VAPOUR HF SYSTEM RELEASED

31.03.2009

Livingston, Scotland, 31 March 2009 - Point 35 Microstructures today announced it is enhancing its memsstar® range of MEMS single wafer fabrication systems with the addition of a vapour-phase oxide-release etching module.   The addition of this technology will enable increased production choices for MEMS device designers, and deliver the benefits of a wide manufacturing process window and process controls thereby maximising yield.

The SVR-vHF oxide release module joins the existing memsstar® SVR-Xe Sacrificial Vapour Release (SVR) module and utilises anhydrous hydrofluoric (aHF) vapour to remove the sacrificial oxide thus releasing the MEMS mechanical structure.

With the addition of the new SVR-vHF module alongside the SVR-Xe module the memsstar® range delivers greater freedom for device designers to choose the optimum process integration scheme for a given device technology. In the memsstar® vapour-based process flow, SVR is followed by plasma-enabled Surface Preparation and Deposition (SPD) providing complete protection of the device from stiction thus increasing the functional yield of devices.

The new process achieves unrivalled etch rates  with excellent uniformity on wafer sizes up to 200mm. Available configurations range from manual load, single wafer load-lock, all the way through to the fully automated, cassette load cluster system.

“Growing market opportunities for MEMS technology are increasing demands on manufacturers to deliver more diverse types of devices while also raising productivity, quality and cost-effectiveness,” said Tony McKie, sales director, Point 35 Microstructures. “Vapour-phase processing holds the key to meeting these demands, and our complete SVR process portfolio supporting oxide and silicon release technologies, will allow designers and manufacturers alike to realise the full market potential of MEMS in increasingly wide-ranging applications.”

Compared to conventional etching processes based on wet chemistry, SVR etching is known to completely remove the sacrificial material without damaging the mechanical structure or inducing stiction, delivering high selectivity, repeatability and uniformity.  SVR leaves dry surfaces with no residue or moisture, which also saves the surface-preparation, acid-introduction, neutralisation, and subsequent drying stages implicit in a wet process

SVR is compatible with CMOS processing and CMOS wafer facilities. This allows MEMS devices to be fabricated in the same facility and on the same substrate as a conventional integrated circuit, which will enable new classes of monolithic MEMS/CMOS devices.  Further benefits of SVR include reduced materials usage and lower waste.

About Point 35 Microstructures

Point 35 Microstructures was founded in 2003 by a team of highly experienced semiconductor industry professionals to supply first class full specification refurbished semiconductor manufacturing process equipment and services.  Refurbished systems are supplied with performance guarantees and certified to the latest CE standards.   In particular the company specializes in equipment from Applied Materials, Lam Research, and Novellus Systems.

In 2004 Point 35 Microstructures introduced the proprietary memsstar® brand of MEMS manufacturing systems.  The MEMS process tools and in-house process integration expertise enables customers to make the successful transition to integrated dry processing and from R&D to high yield manufacturing of MEMS devices.

In 2006 the company was named as the Most Innovative Company by the National Microelectronics Institute. 

For further information please contact: Tony McKie, Sales Director, Point 35 Microstructures, Starlaw Park,

Tel: +44 (0) 1506 409160; Email: info@pt35.com; Web: www.pt35.com